IDModSpec
731MC9S08QE4CLC
Part Number:MC9S08QE4CLC
Description:IC MCU 8BIT 4KB FLASH 32LQFP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Supplier Device Package32-LQFP (7x7)
Program Memory Size4KB (4K x 8)
Digi-Key Part NumberMC9S08QE4CLC-ND
Moisture Sensitivity Level (MSL)3 (168 Hours)
Manufacturer Standard Lead Time10 Weeks
RAM Size256 x 8
Speed20MHz
Base Part NumberMC9S08QE4
Number of I/O26
Core Size8-Bit
PeripheralsLVD, PWM, WDT
Oscillator TypeInternal
EEPROM Size-
Data ConvertersA/D 10x12b
Package / Case32-LQFP
Operating Temperature-40°C ~ 85°C (TA)
Core ProcessorS08
PackagingTray
ConnectivityI²C, LINbus, SCI, SPI
Program Memory TypeFLASH
Other Names935317002557
SeriesS08
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Detailed DescriptionS08 S08 Microcontroller IC 8-Bit 20MHz 4KB (4K x 8) FLASH 32-LQFP (7x7)
732MCIMX6L8DVN10AC
Part Number:MCIMX6L8DVN10AC
Description:I.MX 6SL ROM PERF ENHAN
Lead Free Status / RoHS Status:
RAM ControllersLPDDR2, LVDDR3, DDR3
Seriesi.MX6SL
Moisture Sensitivity Level (MSL)3 (168 Hours)
Core ProcessorARM® Cortex®-A9
Other Names935352982557
USBUSB 2.0 + PHY (3)
Digi-Key Part NumberMCIMX6L8DVN10AC-ND
Ethernet10/100 Mbps (1)
Operating Temperature0°C ~ 95°C (TJ)
SATA-
Co-Processors/DSPMultimedia; NEON™ SIMD
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Voltage - I/O1.2V, 1.8V, 3.0V
Number of Cores/Bus Width1 Core, 32-Bit
Manufacturer Standard Lead Time12 Weeks
Detailed DescriptionARM® Cortex®-A9 Microprocessor IC i.MX6SL 1 Core, 32-Bit 1.0GHz
Graphics AccelerationYes
Display & Interface ControllersKeypad, LCD
Speed1.0GHz
733IS61LV256AL-10TLI
Part Number:IS61LV256AL-10TLI
Description:IC SRAM 256K PARALLEL 28TSOP I
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Write Cycle Time - Word, Page10ns
Supplier Device Package28-TSOP I
Memory TypeVolatile
Manufacturer Standard Lead Time10 Weeks
TechnologySRAM - Asynchronous
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Detailed DescriptionSRAM - Asynchronous Memory IC 256Kb (32K x 8) Parallel 10ns 28-TSOP I
Other Names706-1037
"######"IS61LV256AL10TLI
Package / Case28-TSSOP (0.465, 11.80mm Width)
Access Time10ns
Memory InterfaceParallel
Voltage - Supply3.135 V ~ 3.6 V
Mounting TypeSurface Mount
Memory FormatSRAM
Memory Size256Kb (32K x 8)
Moisture Sensitivity Level (MSL)3 (168 Hours)
Operating Temperature-40°C ~ 85°C (TA)
PackagingTray
Series-
Digi-Key Part Number706-1037-ND
734MCIMX6Q6AVT08AD
Part Number:MCIMX6Q6AVT08AD
Description:IC MPU I.MX6Q 852MHZ 624FCBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
SATASATA 3Gbps (1)
Graphics AccelerationYes
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case624-FBGA, FCBGA
Core ProcessorARM® Cortex®-A9
Supplier Device Package624-FCBGA (21x21)
Co-Processors/DSPMultimedia; NEON™ SIMD
Additional InterfacesCAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Digi-Key Part NumberMCIMX6Q6AVT08AD-ND
PackagingTray
Operating Temperature-40°C ~ 125°C (TJ)
Speed852MHZ
Other Names935316461557
Moisture Sensitivity Level (MSL)3 (168 Hours)
Lead Free Status / RoHS StatusLead free / RoHS Compliant
USBUSB 2.0 + PHY (4)
Ethernet10/100/1000 Mbps (1)
Display & Interface ControllersKeypad, LCD
Detailed DescriptionARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 852MHZ 624-FCBGA (21x21)
RAM ControllersLPDDR2, LVDDR3, DDR3
Seriesi.MX6Q
Voltage - I/O1.8V, 2.5V, 2.8V, 3.3V
Number of Cores/Bus Width4 Core, 32-Bit
735IS61LV51216-10TLI
Part Number:IS61LV51216-10TLI
Description:IC SRAM 8M PARALLEL 44TSOP II
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Series-
Detailed DescriptionSRAM - Asynchronous Memory IC 8Mb (512K x 16) Parallel 10ns 44-TSOP II
Mounting TypeSurface Mount
Memory TypeVolatile
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Memory FormatSRAM
Digi-Key Part NumberIS61LV51216-10TLI-ND
Moisture Sensitivity Level (MSL)3 (168 Hours)
Memory Size8Mb (512K x 16)
Memory InterfaceParallel
Access Time10ns
PackagingTray
Package / Case44-TSOP (0.400, 10.16mm Width)
Write Cycle Time - Word, Page10ns
Operating Temperature-40°C ~ 85°C (TA)
TechnologySRAM - Asynchronous
Voltage - Supply3.135 V ~ 3.6 V
Supplier Device Package44-TSOP II
736MCIMX6Q7CVT08AE
Part Number:MCIMX6Q7CVT08AE
Description:I.MX6Q ROM PERF ENHAN
Lead Free Status / RoHS Status:
Seriesi.MX6Q
Core ProcessorARM® Cortex®-A9
Moisture Sensitivity Level (MSL)3 (168 Hours)
USBUSB 2.0 + PHY (4)
Operating Temperature-40°C ~ 105°C (TA)
Graphics AccelerationYes
SATASATA 3Gbps (1)
Voltage - I/O1.8V, 2.5V, 2.8V, 3.3V
RAM ControllersLPDDR2, LVDDR3, DDR3
Manufacturer Standard Lead Time15 Weeks
Number of Cores/Bus Width4 Core, 32-Bit
Ethernet10/100/1000 Mbps (1)
Digi-Key Part NumberMCIMX6Q7CVT08AE-ND
Co-Processors/DSPMultimedia; NEON™ SIMD
Other Names935354334557
Detailed DescriptionARM® Cortex®-A9 Microprocessor IC i.MX6Q 4 Core, 32-Bit 800MHz
Display & Interface ControllersKeypad, LCD
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHz
737PIC16F914-I/P
Part Number:PIC16F914-I/P
Description:IC MCU 8BIT 7KB FLASH 40DIP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
SeriesPIC® 16F
Digi-Key Part NumberPIC16F914-I/P-ND
Oscillator TypeInternal
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Operating Temperature-40°C ~ 85°C (TA)
Package / Case40-DIP (0.600, 15.24mm)
Core Size8-Bit
Supplier Device Package40-PDIP
Core ProcessorPIC
Speed20MHz
Number of I/O35
Detailed DescriptionPIC PIC® 16F Microcontroller IC 8-Bit 20MHz 7KB (4K x 14) FLASH 40-PDIP
PeripheralsBrown-out Detect/Reset, LCD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)2 V ~ 5.5 V
Program Memory Size7KB (4K x 14)
Moisture Sensitivity Level (MSL)1 (Unlimited)
ConnectivityI²C, SPI, UART/USART
Base Part NumberPIC16F914
Other NamesPIC16F914IP
Program Memory TypeFLASH
Data ConvertersA/D 8x10b
EEPROM Size256 x 8
PackagingTube
RAM Size256 x 8
Manufacturer Standard Lead Time4 Weeks
738IS61LV6416-10TL
Part Number:IS61LV6416-10TL
Description:IC SRAM 1M PARALLEL 44TSOP II
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Operating Temperature0°C ~ 70°C (TA)
Memory InterfaceParallel
Voltage - Supply3.135 V ~ 3.6 V
TechnologySRAM - Asynchronous
Access Time10ns
Supplier Device Package44-TSOP II
Memory Size1Mb (64K x 16)
Mounting TypeSurface Mount
Write Cycle Time - Word, Page10ns
PackagingTray
Manufacturer Standard Lead Time6 Weeks
Other Names706-1039
"######"IS61LV641610TL
Memory TypeVolatile
Series-
Moisture Sensitivity Level (MSL)3 (168 Hours)
Digi-Key Part Number706-1039-ND
Package / Case44-TSOP (0.400, 10.16mm Width)
Memory FormatSRAM
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Detailed DescriptionSRAM - Asynchronous Memory IC 1Mb (64K x 16) Parallel 10ns 44-TSOP II
739MC9S12XD256VAL
Part Number:MC9S12XD256VAL
Description:IC MCU 16BIT 256KB FLASH 112LQFP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Oscillator TypeExternal
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Detailed DescriptionHCS12X HCS12X Microcontroller IC 16-Bit 80MHz 256KB (256K x 8) FLASH 112-LQFP (20x20)
SeriesHCS12X
ConnectivityCANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
EEPROM Size4K x 8
Other Names935319085557
Operating Temperature-40°C ~ 105°C (TA)
Program Memory Size256KB (256K x 8)
Digi-Key Part NumberMC9S12XD256VAL-ND
Core ProcessorHCS12X
Voltage - Supply (Vcc/Vdd)2.35 V ~ 5.5 V
Core Size16-Bit
Supplier Device Package112-LQFP (20x20)
Data ConvertersA/D 16x10b
Program Memory TypeFLASH
Package / Case112-LQFP
Base Part Number9S12XD256
Speed80MHz
PeripheralsLVD, POR, PWM, WDT
PackagingTray
Number of I/O91
Moisture Sensitivity Level (MSL)3 (168 Hours)
RAM Size14K x 8
740MCIMX6S4AVM08AC
Part Number:MCIMX6S4AVM08AC
Description:IC MPU I.MX6S 800MHZ 624MAPBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Number of Cores/Bus Width1 Core, 32-Bit
Seriesi.MX6S
RAM ControllersLPDDR2, LVDDR3, DDR3
USBUSB 2.0 + PHY (4)
Speed800MHz
Supplier Device Package624-MAPBGA (21x21)
Operating Temperature-40°C ~ 125°C (TJ)
Graphics AccelerationYes
Ethernet10/100/1000 Mbps (1)
Display & Interface ControllersKeypad, LCD
Co-Processors/DSPMultimedia; NEON™ SIMD
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Voltage - I/O1.8V, 2.5V, 2.8V, 3.3V
PackagingTray
Digi-Key Part Number568-14307-ND
Other Names568-14307
"######"935311642557
"######"MCIMX6S4AVM08AC-ND
Core ProcessorARM® Cortex®-A9
Detailed DescriptionARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Package / Case624-LFBGA
Additional InterfacesCAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA-
Moisture Sensitivity Level (MSL)3 (168 Hours)